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3M Thermally Conductive tape 8904-025X40MT

Application Ideas:

  • IC chip packaging heat conduction
  • COF chip heat conduction
  • General Heat sink Bonding
  • Printed circuit board

More details

Availability: Unit

Rs.3,597.00

Application Ideas:

  • IC chip packaging heat conduction
  • COF chip heat conduction
  • General Heat sink Bonding
  • Printed circuit board
  • LED module/board bonding
  • Flat panel display heat conduction

Key Features:

  • Excellent dielectric performance
  • Low thermal impedance
  • Good and reliable adhesion performance against A1 and USU
  • Good thermal conductivity (>1.5W/m-K)

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3M Thermally Conductive tape 8904-025X40MT

3M Thermally Conductive tape 8904-025X40MT

Application Ideas:

  • IC chip packaging heat conduction
  • COF chip heat conduction
  • General Heat sink Bonding
  • Printed circuit board

Write your review

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